They now use intrusive soldering that solders surface mount and through-hole components at the same time:

The idea behind intrusive soldering, also known as pin-in-paste soldering is simple: solder paste is printed onto or around a through-hole pad, and the through-hole component is passed into reflow with your SMD components. The molten solder paste then fills in the through-hole and attaches the component pin.

Now english is not my first language, but “reactor grabs 97.5% of lithium from geothermal sources” and “…it achieved a lithium purity rate of 97.5%.” do not sound like the same thing.